Nordic Chip Meet-Up in Trondheim, 29 – 30 September 2026
A two-day gathering in Trondheim bringing together Nordic and European stakeholders from industry and academia to collaborate on the future of semiconductors
Join us in Trondheim this September for the Nordic Chip Collaboration Meetup, a side event of the Trondheim Tech Festival, where industry and academia come together to shape the future of semiconductors in the Nordic countries.
Over two days (29–30 September), we will bring together key players from across the Nordics to share insights, collaborate, and explore new opportunities in chips, design, and advanced technologies. Building on the success of our previous events in Helsinki (2024) and Lund (2025), this gathering will unite stakeholders from across the Nordic and European chip ecosystem to strengthen partnerships and foster collaboration.
Programme
Day 1 runs from 09:00 to approximately 16:30, followed by an optional networking dinner. Day 2 is a day of three site visits.
Please note that the afternoon sessions on Day 1 run as two parallel tracks — you choose one session from each pair. Coffee breaks and lunch are included throughout the day. This is an indicative programme and may be subject to change.
Day 1 - 29 September
Morning 9:00 - 12:00
Registration, Coffee & Welcome address
Plenary session: Chips Design – a Nordic Stronghold (Keynotes)
The Nordics have built a strong and globally competitive position in chip design across wireless, sensing, embedded systems, and advanced ASICs. This session highlights key strengths, success factors, and opportunities to further scale in a global landscape.
Confirmed speakers:
- Vegard Wollan, Nordic Semiconductor – Chief Executive Officer / President
- Veijo Kontas, Wstcon Oy / FiCCC / Tamllink – CEO & Senior Advisor
- Fredrik Tillman, Ericsson Research – Senior Research Manager
- Moderator: Toni Mattila, Business Finland
Early afternoon 12:00 - 14:00 · Choose one of two parallel sessions
Session A: Behind the EU Chips Design Platform (EuroCDP)
An inside look at Europe’s new chip design platform, bringing together tools, IP, funding, and access to prototyping and fabrication in one place. The session explores how EuroCDP aims to lower barriers, accelerate innovation, and strengthen Europe’s semiconductor ecosystem.
Confirmed speakers:
- Romano Hoofman, imec - Strategic Development Director
- Vemund Bakken, Onio - Chief technology officer and co-founder
Session B: Chip Packaging & heterogeneous integration
Advanced packaging and heterogeneous integration are becoming key drivers of performance and innovation as scaling at the transistor level slows. This session explores developments such as chiplets and 3D integration, and what they mean for Nordic industry and value chains.
Confirmed speakers:
- Dr. Teresa Orellana Pérez, APECS Pilot Line, Research Fab Microelectronics Germany (FMD)
- Alan Moghal, Intel Ireland - Advanced Packaging, Area Manager
- Feng-I Tai, Business Sweden - Semiconductor Program Lead, Materials & Industrials
Late afternoon 14:00 - 16:00 · Choose one of two parallel sessions
Session C: AI Workflows for Chip Design
AI is rapidly transforming chip development, from architecture and design to verification and optimization. This session explores practical use cases and what these changes mean for innovation and future competitiveness.
Confirmed speakers:
- Kirill Bykov, Arm - Staff Engineer
- Jo Uthus, Nordic Semiconductor – EVP
- Frode Sundal. Microchip - Associate Director
- David Conochie. IC Optimize - CSO
- Steinar Brede, Innovation Norway - Special Advisor
Session D: Talent Development & Attraction
Access to skilled talent is critical for strengthening the semiconductor ecosystem in an increasingly competitive global market. This session looks at how the Nordics can build and attract talent across the full value chain, from education and reskilling to international recruitment.
Confirmed speakers:
- Joachim Rodrigues, Lund University/ FAU (Friedrich-Alexander-Universität)/ BCDC
- Carsten Wulff, NTNU / Nordic Semiconductor
- Pierre-Alexandre Bou-Ach, Arm
- Sayani Majumdar, Tampere University - Associate Professor, Electrical Engineering
The day will conclude with an optional networking dinner.
Day 2 - Wednesday 30 September
Day 2 of the Nordic Chip Collaboration event will offer participants the opportunity to experience the ecosystem first-hand through industry visits in Trondheim. Participants will gain unique insights into leading Nordic companies and research environments, exploring how innovation in semiconductors is applied in practice and creating value across the semiconductor value chain.
Visits to: Nordic Semiconductor, Arm Norway and Microchip